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ASRock X570 Phantom Gaming X – VRM Analysis

Gabriele Atzeni di Gabriele Atzeni
11 Settembre 2019
in Analisi VRM, Reviews, Schede Madri
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1. VCore and iGPU

  • 1. VCore and iGPU
  • 2. Memory VRM
  • 3. Conclusion

A few days ago, we released our review of the ASRock X570 Phantom Gaming X (Italian), a motherboard that needs no introduction thanks to its solid design, quality construction and on-board features; this board received our Hardware Platinum Award, and today we’ll take a deep dive into its VRM, to see if the power delivery section is on par with the rest of the mainboard.

VCore and SOC

The VCore section of the ASRock X570 Phantom Gaming X is overbuilt, overkill and overpowered, featuring the controller Intersil ISL69147, which can be seen as the AMD-only version of the ISL69138, handling a maximum of 7 phases, with 14 SiC634 phases from Vishay, each one rated for 50A.

Doublers

Obviously, 14 phases are achieved thank to the PWM Intersil 6617A doublers (duplicating the 6 phases for the CPU and the single one for the SOC), a smart doubler integrating load balancing (load and temperature-based), current monitoring and overvoltage protection.

Let’s take a look at the efficiency of the VRM with the heat output of the VCore based on the load:

VCore Switching Frequency Current Heat
1,0 V 500 kHz 100 A 8 W
1,0 V 500 kHz 150 A 12 W
1,0 V 500 kHz 200 A 18 W
1,0 V 500 kHz 250 A 25 W
1,0 V 500 kHz 300 A 36 W
1,0 V 500 kHz 400 A 56 W
1,0 V 500 kHz 500 A 85 W
1,0 V 500 kHz 600 A 120 W

100A to 200A is the range in which the R7 3800X, R9 3900X and R9 3950X would normally operate, ranging from stock clocks to ambient-cooling overclock, and yet the total heat produced by its phases will easily be handled by the massive heatsinks installed on the VRMs; the higher current values are usually for Liquid Nitrogen overclocking whereas the last value (600A) is the maximum amount of current that will be handled, continuously, by the VCore VRMs.

Back armour and VRM cooling

The phases are cooled by two aluminium blocks (Super Alloy XXL) with a substantial mass and have “aerodynamic” fins to improve heat dissipation. The armour plate, located on the back of the motherboard, provides structural solidity, but no sort of cooling.

Jump to section

1. VCore and iGPU

  • 1. VCore and iGPU
  • 2. Memory VRM
  • 3. Conclusion
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Tags: am4asrockAsRock X570Intersilphantom gaming xpower deliverySino PowerSinoPowerVishayvrmX570
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Gabriele Atzeni

Gabriele Atzeni

Sin da bambino appassionato di elettronica e PC, ha smontato il suo primo PC nel 1990 per poi litigare coi vari gestori di negozi di spare parts perchè non avevano il pezzo che diceva lui, dimostrandosi precocemente precisino e rompiscatole. Sportivo, amante delle freddure e se avete bisogno di supporto morale è la persona giusta. Nel supporto immorale poi, non teme confronti.

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